A comprehensive 10-hour course covering the fundamentals, methodologies, and practical considerations of testing semiconductor components and packages. Participants will explore both automated and benchtop testers, key test principles (functional, parametric, boundary-scan, in-circuit, flying-probe), data analysis techniques, design for testability strategies, and best practices in tester calibration and maintenance. Real-world case studies and hands-on examples ensure immediate applicability to reliability, yield enhancement, and quality assurance in semiconductor packaging.

➢ Duration of Modules

➢ Learning Outcomes

By the end of this course, participants will be able to:

1. Articulate the role of component and package testing in semiconductor reliability and yield improvement.
2. Distinguish among functional, parametric, boundary-scan, in-circuit, and flying-probe testing methodologies, including their strengths, limitations, and application scenarios.
3. Compare automated test equipment (ATE) with benchtop testers and select appropriate test platforms based on throughput, scalability, and cost.
4. Develop and validate functional test vectors, define pass/fail criteria, and execute timing-constrained pattern generation.
5. Conduct parametric (I–V, C–V) and boundary-scan (JTAG) measurements, interpret results, and troubleshoot scan chain issues.
6. Design and implement in-circuit and flying-probe test flows, including fixture design, coverage metrics, and netlist programming.
7. Analyze test data using statistical techniques (Cp, Cpk, yield indexing), correlate failures with root causes, and generate actionable dashboards.
8. Incorporate Design for Testability (DfT) features—BIST, embedded instrumentation, test pads—into package and PCB layouts without compromising signal integrity.
9. Establish calibration and preventive maintenance protocols for testers, ensuring measurement accuracy, documentation, and traceability.
10. Apply best practices from real-world case studies to detect packaging defects, optimize yield, and solve participant-specific testing challenges.

➢ Target Audience

This course is ideal for:

• Test engineers and process engineers in semiconductor packaging and assembly.
• Reliability engineers focused on failure analysis and yield enhancement.
• Hardware design engineers seeking to integrate DfT features.
• Quality assurance professionals responsible for test strategy and data analysis.
• Lab technicians and managers evaluating tester procurement and maintenance.
• Graduate students and professionals transitioning into semiconductor test roles.