Description

Module 1 provides a comprehensive overview of semiconductor packaging, covering its purpose, benefits, and historical evolution. Learners will explore the fundamentals of how packages protect, interconnect, and enable high-performance integrated circuits. Through real-world examples, you will understand why packaging is critical to reliability, thermal management, and system integration in modern electronics.

➢ What You’ll Learn

• Define semiconductor packaging and its core functions.
• Articulate the need for packaging, including protection, signal integrity, and thermal stewardship.
• Describe the packaging process flow, from substrate design through final inspection.
• Trace the history and evolution of packaging technologies, from DIP to 3D-ICs.
• Differentiate major packaging families and categories, such as through-hole, surface-mount, BGA, CSP, and advanced 2.5D/3D approaches.

➢ Skills You’ll Gain

• Clear understanding of packaging roles in modern devices.
• Ability to map out key manufacturing steps: die attach, underfill, wire bonding, solder balling, and testing.
• Familiarity with historical milestones that shaped package design.
• Competence in classifying packages by construction, application, and performance trade-offs.
• Foundation for evaluating package selection based on mechanical, thermal, and electrical criteria.

➢ Target Audience

Engineers, designers, and technicians seeking a solid introduction to semiconductor packaging, including:

• New graduates entering packaging or test engineering.
• Product‐development professionals requiring packaging insight.
• Manufacturing and quality engineers expanding into packaging processes.
• Anyone interested in the fundamentals of how packaging impacts device reliability and system integration.

➢ Topics Covered

1. What Is Semiconductor Packaging?
   ­- Definition and primary objectives
   ­- Key components: die, substrate, interconnects, and enclosure
2. Need for Packaging
   ­- Protecting silicon from mechanical and environmental damage
   ­- Ensuring electrical connectivity and signal integrity
   ­- Managing heat dissipation and reliability
3. Packaging Process Flow
   ­- Substrate design and material selection
   ­- Die attach and underfill
   ­- Wire bonding vs. flip-chip interconnects
   ­- Ball attach, molding, and curing
   ­- Final test, inspection, and marking
4. History and Evolution of Packaging
   ­- Early DIP and SIP packages
   ­- Transition to surface-mount and BGA
   ­- Emergence of chip-scale (CSP) and wafer-level packaging
   ­- Advanced 2.5D, 3D-IC, and heterogeneous integration
5. Packaging Families and Categories
   ­- Through-hole vs. surface-mount
   ­- Ball Grid Array (BGA) vs. Land Grid Array (LGA)
   ­- Chip-Scale Package (CSP) and Wafer-Level Package (WLP)
   ­- Advanced multi-die and co-packaging solutions

➢  Time duration  4 hours