This intensive 5-hour course provides a comprehensive overview of advanced failure analysis and inspection techniques used in semiconductor packaging. Participants will learn how to apply key electrical, non-destructive, visual, and microscopic test methods—as well as automated inspection systems—to ensure package integrity, enhance yield, and troubleshoot defects effectively.

➢ Duration of Modules

➢ Learning Outcomes

Upon completion of this course, participants will be able to:

• Implement parametric and functional electrical tests to verify package performance.
• Utilize non-destructive X-ray, acoustic, and optical inspection methods for defect detection.
• Set up and operate visual inspection systems, leveraging AI-based anomaly detection.
• Execute advanced failure-analysis workflows, including cross-sectional SEM, FIB-SEM, TEM, and decapsulation techniques.
• Analyze data using SPC and yield-mapping strategies to drive process improvements.
• Integrate inspection findings with manufacturing execution systems for real-time quality control.

➢ Target Audience

This course is designed for:

• Packaging engineers and process development engineers in semiconductor fabrication.
• Failure analysis specialists seeking advanced inspection and diagnostic skills.
• Quality and reliability engineers responsible for package integrity.
• R&D professionals and lab technicians working on semiconductor assembly and test.
• Managers overseeing yield enhancement, quality assurance, and failure-analysis teams.