This self-paced eLearning module provides a comprehensive understanding of process integration and device fabrication in semiconductor manufacturing. Learners will explore how individual fabrication processes are sequenced and optimized to build functional semiconductor devices. Key focus areas include front-end-of-line (FEOL), middle-of-line (MOL), and back-end-of-line (BEOL) integration, along with key device structures like MOSFETs and FinFETs. Through simulations, case studies, and assessments, learners will gain practical insight into modern semiconductor process flows and yield optimization.

➢ Course Objectives

• Understand the role of process integration in semiconductor manufacturing.
• Identify major stages in device fabrication (FEOL, MOL, BEOL).
• Describe the fabrication flow of common devices such as MOSFETs and FinFETs.
• Analyze challenges in device scaling and integration.
• Interpret process integration diagrams and fabrication timelines
• Apply knowledge in case-based scenarios and interactive simulations

➢  Time duration 3 to 4 hours