This intensive 9-hour module delves into the critical manufacturing steps that transform a bare die into a fully encapsulated, ready-to-use semiconductor package. Participants will explore best-practice techniques—from wafer thinning and die singulation through advanced interconnect formation and final encapsulation—gaining hands-on insight into equipment, materials, and process controls essential for modern IC packaging operations.

➢ Curriculum Duration

Total Contact Hours: 9 hours

• A. Die Preparation (1.5 hrs)
  – Wafer thinning
  – Dicing and singulation
• B. Die Attachment (1 hr)
  – Die-attach adhesives
  – Eutectic die-attach methods
• C. Interconnect Formation (2.5 hrs)
  – Wire bonding (gold, aluminum)
  – Flip-chip processes (solder bumping, under-bump metallurgy)
• D. Cleaning and Underfill (1 hr)
  – Flux cleaning techniques
  – Underfill materials and process
• E. Encapsulation and Marking (1.5 hrs)
  – Molding compounds and encapsulation methods
  – Laser marking
• F. Ball Attach and Reflow (1 hr)
  – Solder ball attachment
  – Reflow profiling
• G. Equipment and Operations (1.5 hrs)
  – IC packaging toolsets
  – Cleanroom protocols and safety

➢ Skills You’ll Gain

• Mastery of wafer thinning and precision dicing techniques
• Selection and application of die-attach adhesives and eutectic systems
• Proficiency in wire bonding and flip-chip interconnect formation
• Understanding of flux cleaning and underfill process optimization
• Knowledge of encapsulation materials, molding methods, and laser marking
• Expertise in solder ball attachment and thermal profiling for reflow
• Operational competency with IC packaging equipment and cleanroom best practices

➢ Target Audience

This module is designed for:

• Process engineers and technicians in semiconductor packaging
• Manufacturing engineers seeking to optimize yield and reliability
• Quality engineers focused on package integrity and failure analysis
• R&D professionals developing advanced packaging solutions
• Cleanroom operations personnel and equipment maintenance staff

Participants will leave with both theoretical understanding and practical insights to implement robust, high-throughput packaging processes in production environments